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| Obsolete Device TC911A/TC911B Monolithic Auto-Zeroed Operational Amplifiers Features * First Monolithic Chopper-Stabilized Amplifier with On-Chip Nulling Capacitors * Low Offset Voltage: 5V * Low Offset Voltage Drift: 0.05V/C * Low Supply Current: 350A * High Common-Mode Rejection: 116dB * Single Supply Operation: 4.5V to 16V * High Slew Rate: 2.5V/sec * Wide Bandwidth: 1.5MHz * High Open-Loop Voltage Gain: 120dB * Low Input Noise Voltage: 0.65VP-P (0.1Hz to 1Hz) * Pin Compatible With ICL7650 * Lower System Parts Count Package Type 8-Pin PDIP NC 1 - Input 2 + Input 3 VSS 4 8 NC TC911ACPA TC911BCPA 7 VDD 6 Output 5 NC 8-Pin SOIC NC 1 - Input 2 + Input 3 VSS 4 TC911ACOA TC911BCOA 8 NC 7 VDD 6 Output 5 NC Applications * * * * * Instrumentation Portable/Battery Powered Embedded Control Temperature Sensor Amplifier Strain Gage Amplifier NC = No Internal Connection Device Selection Table Part Number Package Temperature Offset Range Voltage 15V 15V 30V 30V 0C to +70C 0C to +70C TC911ACOA 8-Pin SOIC 0C to +70C TC911ACPA 8-Pin PDIP TC911BCPA 8-Pin PDIP TC911BCOA 8-Pin SOIC 0C to +70C (c) 2005 Microchip Technology Inc. DS21481C-page 1 TC911A/TC911B General Description The TC911 CMOS auto-zeroed operational amplifier is the first complete monolithic chopper stabilized amplifier. Chopper operational amplifiers like the ICL7650/ 7652 and LTC1052 require user supplied, external offset compensation storage capacitors. External capacitors are not required with the TC911. Just as easy to use as the conventional OP07 type amplifier, the TC911 significantly reduces offset voltage errors. Pinout matches the OP07/741/7650 8-pin mini-DIP configuration. Several system benefits arise by eliminating the external chopper capacitors: lower system parts count, reduced assembly time and cost, greater system reliability, reduced PC board layout effort and greater board area utilization. Space savings can be significant in multiple amplifier designs. Electrical specifications include 15V maximum offset voltage and 0.15V/C maximum offset voltage temperature co-efficient. Offset voltage error is five times lower than the premium OP07E bipolar device. The TC911 improves offset drift performance by eight times. The TC911 operates from dual or single power supplies. Supply current is typically 350A. Single 4.5V to 16V supply operation is possible, making single 9V battery operation possible. The TC911 is available in 2 package types: 8-pin plastic DIP and SOIC. Functional Block Diagram VDD 4 VOS VSS 7 Correction Amplifier -Input 2 + - A * B Internal Oscillator (FOSC 200HZ) B * A +Input 3 + + - Main Amplifier Low Impedance Output Buffer 6 Output - TC911A TC911B Note: Internal capacitors. No external capacitors required. DS21481C-page 2 (c) 2005 Microchip Technology Inc. TC911A/TC911B 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Total Supply Voltage (VDD to VSS) ........................-18V Input Voltage .................... VDD + 0.3V) to (VSS - 0.3V) Current Into Any Pin............................................ 10mA While Operating ...................................... 100A Package Power Dissipation (TA - 70C) Plastic DIP............................................. 730mW Plastic SOIC .......................................... 470mW Operating Temperature Range C Device....................................... 0C to +70C Storage Temperature Range.............. -65C to +150C TC911A AND TC911B ELECTRICAL SPECIFICATIONS Electrical Characteristics: VS = 5V, TA = +25C, unless otherwise indicated. TC911A Symbol VOS TCVOS Parameter Input Offset Voltage Average Temp. Coefficient of Input Offset Voltage Average Input Bias Current Average Input Offset Current Input Voltage Noise Common Mode Rejection Ratio Common Mode Voltage Range Open-Loop Voltage Gain Output Voltage Swing Closed Loop Bandwidth Slew Rate Power Supply Rejection Ratio Operating Supply Voltage Range Quiescent Supply Current Min -- -- -- Typ 5 0.05 0.05 Max 15 0.15 0.15 Min -- -- -- TC911B Typ 15 0.1 0.1 Max 30 0.25 0.25 Unit V Test Conditions TA = +25C V/C 0C TA +70C V/C -25C TA +85C (Note 1) pA nA nA pA nA VP-P VP-P dB V dB V MHz RL = 10k, VOUT = 4V RL = 10k Closed Loop Gain = +1 TA = +25C 0C TA +70C -25C TA +85 TA = +25C TA = +85C 0.1 to 1Hz, RS 100 0.1 to 10Hz, RS 100 VSS VCM VDD - 2.2 IB -- -- -- -- -- -- -- 110 VSS 115 VSS + 0.3 -- -- 112 3.3 6.5 -- -- -- -- 5 -- 0.65 11 116 -- 120 -- 1.5 2.5 -- -- -- 350 70 3 4 20 1 -- -- -- VDD - 2 -- VDD - 0.9 -- -- -- 8 16 600 -- -- -- -- -- -- -- 105 VSS 110 VSS + 0.3 -- -- 105 3.3 6.5 -- -- -- -- 10 -- 0.65 11 110 -- 120 -- 1.5 2.5 -- -- -- -- 120 4 6 40 1 -- -- -- VDD - 2 -- VDD - 0.9 -- -- -- 8 16 800 IOS eN CMRR CMVR AOL VOUT BW SR PSRR VS V/sec RL = 10k, CL = 50pF dB 3.3V to 5.5V V V A Split Supply Single Supply VS = 5V IS Note 1: Characterized; not 100% tested. (c) 2005 Microchip Technology Inc. DS21481C-page 3 TC911A/TC911B 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in TABLE 2-1: Pin Number 1, 5, 8 2 3 4 6 7 PIN FUNCTION TABLE 3.2 Symbol NC -INPUT +INPUT VSS OUTPUT VDD Description No Internal Connection. Inverting Input Non-inverting Input Negative Power Supply Output Positive Power Supply Thermocouple Errors 3.0 3.1 DETAILED DESCRIPTION Pin Compatibility Heating one joint of a loop made from two different metallic wires causes current flow. This is known as the Seebeck effect. By breaking the loop, an open circuit voltage (Seebeck voltage) can be measured. Junction temperature and metal type determine the magnitude. Typical values are 0.1V/C to 10V/C. Thermal induced voltages can be many times larger than the TC911 offset voltage drift. Unless unwanted thermocouple potentials can be controlled, system performance will be less than optimum. Unwanted thermocouple junctions are created when leads are soldered or sockets/connectors are used. Low thermo-electric coefficient solder can reduce errors. A 60% Sn/36% Pb solder has 1/10 the thermal voltage of common 64% Sn/36% Pb solder at a copper junction. The number and type of dissimilar metallic junctions in the input circuit loop should be balanced. If the junctions are kept at the same temperature, their summation will add to zero-canceling errors (Figure 3-1). Shielding precision analog circuits from air currents especially those caused by power dissipating components and fans - will minimize temperature gradients and thermocouple induced errors. The CMOS TC911 is pin compatible with the industry standard ICL7650 chopper stabilized amplifier. The ICL7650 must use external 0.1F capacitors connected at pins 1 and 8. With the TC911, external offset voltage error canceling capacitors are not required. On the TC911 pins 1, 8 and 5 are not connected internally. The ICL7650 uses pin 5 as an optional output clamp connection. External chopper capacitors and clamp connections are not necessary with the TC911. External circuits connected to pins 1, 8 and 5 will have no effect. The TC911 can be quickly evaluated in existing ICL7650 designs. Since external capacitors are not required, system part count, assembly time and total system cost are reduced. Reliability is increased and PC board layout eased by having the error storage capacitors integrated on the TC911 chip. The TC911 pinout matches many existing op amps: 741, LM101, LM108, OP05-OP08, OP-20, OP-21, ICL7650 and ICL7652. In many applications operating from +5V supplies, the TC911 offers superior electrical FIGURE 3-1: UNWANTED THERMOCOUPLE ERRORS ELIMINATED BY REDUCING THERMAL GRADIENTS AND BALANCING JUNCTIONS J 3 = J4 J2 = J5 No Temperature Differential and same J1 = J6 Metallic Connection J2 J1 J3 J2 Package - Pin J3 V3 + + J4 V4 - + V2 - + J1 V1 - VT = V1 + V2 + V3 - V4 - V5 - V6 = 0 J4 J5 J6 VT = 0 + V5 J5 - + V6 J6 - DS21481C-page 4 (c) 2005 Microchip Technology Inc. TC911A/TC911B 3.3 Avoiding Latchup Junction isolated CMOS circuits inherently contain a parasitic p-n-p-n transistor circuit. Voltages exceeding the supplies by 0.3V should not be applied to the device pins. Larger voltages can turn the p-n-p-n device on, causing excessive device power supply current and excessive power dissipation. TC911 power supplies should be established at the same time or before input signals are applied. If this is not possible, input current should be limited to 0.1mA to avoid triggering the p-n-p-n structure. 3.4 Overload Recovery The TC911 recovers quickly from the output saturation. Typical recovery time from positive output saturation is 20msec. Negative output saturation recovery time is typically 5msec. (c) 2005 Microchip Technology Inc. DS21481C-page 5 TC911A/TC911B 4.0 TYPICAL APPLICATIONS THERMOMETER CIRCUIT FIGURE 4-2: 10-VOLT PRECISION REFERENCE +15V FIGURE 4-1: +9V Temp Out TC911 REF02 ADJ VREF R1 - + R3 VOUT R2 18 k 3 2 TC911 + - 7 6 4 0.1F 3.6 k VOUT = 10V 6.4V 6.4 k VOUT = VTEMP 1 + R2 d VOUT dT K=1+ [ ( R 3 + R1 R3 X R1 )] [ - dT VREF R2 R1 ] [ 1 + R2 ( R3 + R1 R3 X R1 )] d (VTEMP) K (2.1 mV/C) R2 R3 X R1 FIGURE 4-3: +5V PROGRAMMABLE GAIN AMPLIFIER WITH INPUT MULTIPLEXER -5V GND +5V -5V TC911 IN1 IN2 IN3 IN4 IC1b IC1b + VOUT - +5V -5V X1 X 10 18k Input Channel Select X 100 99k X 1000 999k A1 A2 A3 A4 WR 68HC11 Gain Select WR A1 Latch A2 A3 GND A4 2k 1k 1k IC1a, b, = Quad Analog Switch DS21481C-page 6 (c) 2005 Microchip Technology Inc. TC911A/TC911B 5.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Supply Current vs. Supply Voltage 700 600 TA = +25C 450 Supply Current vs. Temperature 35 VS = 5V 30 Input Offset Voltage (V) Input Offset Voltage vs. Common-Mode Voltage VS = 5V TA = +25C 400 Supply Current (A) 500 400 300 200 100 0 2 3 4 5 6 Supply Voltage (V) 7 8 Supply Current (A) 25 20 15 10 5 350 300 250 200 -100 0 -50 0 50 100 Ambient Temperature (C) 150 -6 -5 -4 -3 -2 -1 0 1 2 3 Input Common Mode Voltage (V) 4 Gain and Phase vs. Frequency 50 40 Closed Loop Gain (dB) Large Signal Output Switching Waveform 225 180 135 PHASE (deg) Output Voltage Swing vs. Load Resistance 5.8 TA = +25C VS = 5V -Swing 30 20 10 0 -10 -20 -30 -40 10k GAIN PHASE VS = 5V TA = +25C RL = 10k RL = 10k T = +25C Input Vertical Scale = 2 V/DIV A Output Vertical Scale = 1 V/DIV 0V Output Voltage (V) 5.0 4.2 3.4 2.6 1.8 90 45 0 -45 -90 +Swing -135 100k 1M Frequency (Hz) -180 10M Horizontal Scale = 2s/DIV 1.0 100 1k 10k 100k 1M Load Resistance () (c) 2005 Microchip Technology Inc. DS21481C-page 7 TC911A/TC911B 6.0 6.1 PACKAGING INFORMATION Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in DS21481C-page 8 (c) 2005 Microchip Technology Inc. TC911A/TC911B 6.3 Package Dimensions 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40) Dimensions: inches (mm) 8 MAX. 8-Pin Plastic DIP PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87) 3 MIN. .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) Dimensions: inches (mm) Dimensions: inches (mm) (c) 2005 Microchip Technology Inc. DS21481C-page 9 TC911A/TC911B NOTES: DS21481C-page 10 (c) 2005 Microchip Technology Inc. TC911A/911B SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. (c) 2005 Microchip Technology Inc. DS21481C-page 11 TC911A/911B NOTES: DS21481C-page 12 (c) 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2005 Microchip Technology Inc. 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